Semiconductor Device and Fabrication Method

Semiconductor Device and Fabrication Method

In various embodiments, a semiconductor device may include: a carrier; a semiconductor chip disposed over a first side of the carrier; a layer stack disposed between the carrier and the semiconductor chip or over a second side of the carrier opposite the semiconductor chip, or both, the layer stack...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE KEAN CHEONG, OTREMBA RALF, HOEGLAUER JOSEF, LEE TECK SIM, POH YONG CHERN, SCHLOEGEL XAVER, SCHREDL JUERGEN, TAN SZE LIN CELINE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In various embodiments, a semiconductor device may include: a carrier; a semiconductor chip disposed over a first side of the carrier; a layer stack disposed between the carrier and the semiconductor chip or over a second side of the carrier opposite the semiconductor chip, or both, the layer stack including at least a first electrically insulating layer, the first electrically insulating layer having a laminate having a first electrically insulating matrix material and a first mechanically stabilizing material embedded in the first electrically insulating matrix material.