THIN PLATE BURRING PROCESSING METHOD AND THIN PLATE FEMALE SCREW-FORMING METHOD

A thin plate burring processing method includes a first step of forming a thin portion thinner than an original thickness in a target portion by performing crushing processing on the target portion of a plate-like workpiece, a second step of forming a circular through-hole in the thin portion by pun...

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Hauptverfasser: KURIHARA HIROKAZU, MAEDA TAIKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A thin plate burring processing method includes a first step of forming a thin portion thinner than an original thickness in a target portion by performing crushing processing on the target portion of a plate-like workpiece, a second step of forming a circular through-hole in the thin portion by punching processing, and a third step of forming an annular portion rising from a surface of the workpiece by performing projection processing with burring processing around the through-hole formed in the thin portion.