TRANSCEIVER AND INTERFACE FOR IC PACKAGE

An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GUETIG KEITH, MUSSER RANDALL, VICICH BRIAN, MONGOLD JOHN, VERDIELL JEAN-MARC ANDRE, ZBINDEN ERIC
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.