SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE
This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in "bare die" f...
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| creator | CORLETT BARRY GOH DAVE LIN GLORIA GARDNER BRYSON FISHER JOSEPH SALEHI AMIR PYPER DENNIS |
| description | This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in "bare die" form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board ("flex"). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013141861A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013141861A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013141861A13</originalsourceid><addsrcrecordid>eNrjZLAMjgwOcfUNVnD0c1HwdQ3x8HcJVnDzD1IICPIP83Tx9HNXcFSAqNH199N11A0OdQoOCXIMceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhsaGJoYWZoaOhsbEqQIAQKEpyg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE</title><source>esp@cenet</source><creator>CORLETT BARRY ; GOH DAVE ; LIN GLORIA ; GARDNER BRYSON ; FISHER JOSEPH ; SALEHI AMIR ; PYPER DENNIS</creator><creatorcontrib>CORLETT BARRY ; GOH DAVE ; LIN GLORIA ; GARDNER BRYSON ; FISHER JOSEPH ; SALEHI AMIR ; PYPER DENNIS</creatorcontrib><description>This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in "bare die" form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board ("flex"). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.</description><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130606&DB=EPODOC&CC=US&NR=2013141861A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130606&DB=EPODOC&CC=US&NR=2013141861A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CORLETT BARRY</creatorcontrib><creatorcontrib>GOH DAVE</creatorcontrib><creatorcontrib>LIN GLORIA</creatorcontrib><creatorcontrib>GARDNER BRYSON</creatorcontrib><creatorcontrib>FISHER JOSEPH</creatorcontrib><creatorcontrib>SALEHI AMIR</creatorcontrib><creatorcontrib>PYPER DENNIS</creatorcontrib><title>SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE</title><description>This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in "bare die" form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board ("flex"). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAMjgwOcfUNVnD0c1HwdQ3x8HcJVnDzD1IICPIP83Tx9HNXcFSAqNH199N11A0OdQoOCXIMceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhsaGJoYWZoaOhsbEqQIAQKEpyg</recordid><startdate>20130606</startdate><enddate>20130606</enddate><creator>CORLETT BARRY</creator><creator>GOH DAVE</creator><creator>LIN GLORIA</creator><creator>GARDNER BRYSON</creator><creator>FISHER JOSEPH</creator><creator>SALEHI AMIR</creator><creator>PYPER DENNIS</creator><scope>EVB</scope></search><sort><creationdate>20130606</creationdate><title>SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE</title><author>CORLETT BARRY ; GOH DAVE ; LIN GLORIA ; GARDNER BRYSON ; FISHER JOSEPH ; SALEHI AMIR ; PYPER DENNIS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013141861A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>CORLETT BARRY</creatorcontrib><creatorcontrib>GOH DAVE</creatorcontrib><creatorcontrib>LIN GLORIA</creatorcontrib><creatorcontrib>GARDNER BRYSON</creatorcontrib><creatorcontrib>FISHER JOSEPH</creatorcontrib><creatorcontrib>SALEHI AMIR</creatorcontrib><creatorcontrib>PYPER DENNIS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CORLETT BARRY</au><au>GOH DAVE</au><au>LIN GLORIA</au><au>GARDNER BRYSON</au><au>FISHER JOSEPH</au><au>SALEHI AMIR</au><au>PYPER DENNIS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE</title><date>2013-06-06</date><risdate>2013</risdate><abstract>This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in "bare die" form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board ("flex"). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
| title | SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE |
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