SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE

This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in "bare die" form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board ("flex"). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.