STACKED SUBSTRATE MOLDING

A transfer mold assembly including a first mold chase; a second mold chase; a first lead frame; at least one first lead frame die mounted on the first lead frame; a second lead frame substantially identical to the first lead frame; at least one second lead frame die mounted on the second lead frame;...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KEONG LIM JIN
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A transfer mold assembly including a first mold chase; a second mold chase; a first lead frame; at least one first lead frame die mounted on the first lead frame; a second lead frame substantially identical to the first lead frame; at least one second lead frame die mounted on the second lead frame; and wherein the first and second mold chases define a transfer mold cavity and wherein the first and second lead frames are positioned in stacked relationship inside the transfer mold cavity. Also disclosed is a method of integrated circuit packaging.