Method for Producing a Dielectric Layer on a Component

Method for Producing a Dielectric Layer on a Component

A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickne...

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Bibliographische Detailangaben
Hauptverfasser: KNAUER ULRICH, EGGS CHRISTOPH, ZOTTL HELMUT, FUERBACHER BRUNO, MAISCH MANFRED, BINNINGER CHARLES
Format: Patent
Sprache:eng
Schlagworte:
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Beschreibung
Zusammenfassung:A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickness or the third topography of the dielectric layer, is adjusted.