Spacer Wafer For Wafer-Level Camera And Method Of Manufacturing Same

A spacer wafer for a wafer-level camera and a method of manufacturing the spacer wafer include positioning a substrate in an additive manufacturing device and forming the spacer wafer over the substrate. The spacer wafer is formed by an additive manufacturing process.

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Bibliographische Detailangaben
Hauptverfasser:	RAUKER GORAN, BARNES GEORGE
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A spacer wafer for a wafer-level camera and a method of manufacturing the spacer wafer include positioning a substrate in an additive manufacturing device and forming the spacer wafer over the substrate. The spacer wafer is formed by an additive manufacturing process.