COMPONENT MOUNTING ARRANGEMENT

A method of connecting a component to a molded article may include disposing a component adjacent to a wall of the article being molded, overlapping a portion of the component with a portion of the wall of the article being molded while the wall is still at least partially molten, and permitting the...

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Bibliographische Detailangaben
1. Verfasser:	GRAUER PETER
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method of connecting a component to a molded article may include disposing a component adjacent to a wall of the article being molded, overlapping a portion of the component with a portion of the wall of the article being molded while the wall is still at least partially molten, and permitting the wall of the article being molded to cool with said portion of the component still overlapped by the wall. Preferably, a portion of the component is overlapped on two sides by the wall of the article being molded to firmly retain the component relative to the article after the article is formed. The article may be a receptacle, or any other object, as desired.