SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Disclosed herein are a semiconductor package and a method for manufacturing the same. The method includes preparing a substrate having one surface and the other surface; mounting a semiconductor device mounted on one surface of the substrate; forming external connection terminals on the other surfac...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HONG JONG KUK, SOHN KEUNG JIN, PARK JUNG HWAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed herein are a semiconductor package and a method for manufacturing the same. The method includes preparing a substrate having one surface and the other surface; mounting a semiconductor device mounted on one surface of the substrate; forming external connection terminals on the other surface of the substrate; forming a warpage preventing layer formed on one surface of the substrate or the other surface of the substrate; and performing a reflow process on the substrate.