CMOS Compatible Microchannel Heat Sink for Electronic Cooling and Its Fabrication

The present invention is a CMOS compatible polymer microchannel heat sink for electronic cooling applications. The heat sink can be fabricated directly on the chip surface with an insulation layer by standard polymer surface micromachining techniques. The heat sink device comprises a thin insulation...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OKUTUCU TUBA OZYURT, KOYUNCUOGLU AZIZ, KULAH HALUK
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL TRANSPORTING WEAPONS WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention is a CMOS compatible polymer microchannel heat sink for electronic cooling applications. The heat sink can be fabricated directly on the chip surface with an insulation layer by standard polymer surface micromachining techniques. The heat sink device comprises a thin insulation layer on the chip surface, a thin-film metal layer as bottom surface, metal side walls, and a polymer top wall over the microchannels and inlet-outlet reservoirs.