Light Emitting Devices with Low Packaging Factor
A light emitting diode that when encapsulated within an overmolded hemispherical lens has a packaging factor less than 1.2.
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| Format: | Patent |
| Sprache: | eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | A light emitting diode that when encapsulated within an overmolded hemispherical lens has a packaging factor less than 1.2. |
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