INDUCTIVE ROTATION ANGLE SENSOR AND METHOD OF MOUNTING THE SAME

An inductive non-contact rotation angle sensor used in a motor-driven throttle valve unit is such that a circuit substrate to which a stationary conductor and an electronic circuit are attached is secured to a resin cover without the use of an adhesive. A TPS substrate as the circuit substrate and a...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE MICHIMORI, HIRANUMA DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	ACTUATING-FLOATS ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COCKS COMBUSTION ENGINES CONTROLLING COMBUSTION ENGINES DEVICES FOR VENTING OR AERATING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS TAPS TARIFF METERING APPARATUS TESTING THERMAL INSULATION IN GENERAL VALVES WEAPONS
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Beschreibung
Zusammenfassung:	An inductive non-contact rotation angle sensor used in a motor-driven throttle valve unit is such that a circuit substrate to which a stationary conductor and an electronic circuit are attached is secured to a resin cover without the use of an adhesive. A TPS substrate as the circuit substrate and an electric conductor are electrically connected to each other by pressure welding (press fit). The circuit substrate and the electric conductor can be formed of the same molding resin as a single molded body. Thus, it is not necessary to prepare another metallic conductor (a bonding wire) and also welding and soldering are eliminated. Further, since the TPS substrate is covered by the same material as cover resin, a process of bonding the substrate to the cover can be omitted, which allows for a reduction in manufacturing cost.