COPPER-BASED SLIDING MATERIAL

A copper-based sliding material including a steel back metal layer and a Cu alloy layer is provided. The Cu alloy layer contains 0.5 to 15 mass % of Sn, 0.2 to 5 mass % of inorganic compound particles and the balance being Cu and unavoidable impurities. The inorganic compound particles are dispersed...

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Bibliographische Detailangaben
Hauptverfasser:	TODA KAZUAKI, TUJIMOTO KENTARO
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BEARINGS BLASTING CASTING CHEMISTRY ELEMENTS OR CRANKSHAFT MECHANISMS ENGINEERING ELEMENTS AND UNITS FERROUS OR NON-FERROUS ALLOYS FLEXIBLE SHAFTS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEATING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIGHTING MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MECHANICAL ENGINEERING METALLURGY PERFORMING OPERATIONS POWDER METALLURGY ROTARY BODIES OTHER THAN GEARING ELEMENTS SHAFTS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THERMAL INSULATION IN GENERAL TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WEAPONS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	A copper-based sliding material including a steel back metal layer and a Cu alloy layer is provided. The Cu alloy layer contains 0.5 to 15 mass % of Sn, 0.2 to 5 mass % of inorganic compound particles and the balance being Cu and unavoidable impurities. The inorganic compound particles are dispersed in a Cu alloy matrix and have an average size of 1 to 10 μm. A ratio of a true density of the Cu alloy matrix in relation to that of the inorganic compound particles is 0.6 to 1.4 and a ratio of a thermal expansion coefficient of the Cu alloy matrix in relation to that of the inorganic compound particles is 1.5 to 3.0. An average distance between the inorganic compound particles dispersed in the Cu alloy matrix is 5 to 50 μm.