METHOD FOR RECOVERING SILICON AND METHOD FOR PRODUCING SILICON

A method for recovering or producing silicon, that can recover or produce silicon using cutting scraps containing silicon carbide abrasive grains and silicon as raw materials without separating those is provided. The present invention is a method for recovering or producing silicon from cutting scra...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIRAHAMA TOSHIKI, YAMAHARA KEIJI, SAWAI TAKESHI, KATAYAMA TOSHIAKI, HASHIGUCHI TADASHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SHIRAHAMA TOSHIKI
YAMAHARA KEIJI
SAWAI TAKESHI
KATAYAMA TOSHIAKI
HASHIGUCHI TADASHI
description A method for recovering or producing silicon, that can recover or produce silicon using cutting scraps containing silicon carbide abrasive grains and silicon as raw materials without separating those is provided. The present invention is a method for recovering or producing silicon from cutting scraps containing silicon carbide, which are produced during a cutting or grinding of silicon ingots or silicon wafers, wherein the method comprises producing silicon by heating the cutting scraps containing silicon carbide, and a silica raw material.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013001816A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013001816A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013001816A13</originalsourceid><addsrcrecordid>eNrjZLDzdQ3x8HdRcPMPUghydfYPcw3y9HNXCPb08XT291Nw9HNRQFIREOTvEuqMpICHgTUtMac4lRdKczMou7mGOHvophbkx6cWFyQmp-allsSHBhsZGBobGBhaGJo5GhoTpwoA9rAq6Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR RECOVERING SILICON AND METHOD FOR PRODUCING SILICON</title><source>esp@cenet</source><creator>SHIRAHAMA TOSHIKI ; YAMAHARA KEIJI ; SAWAI TAKESHI ; KATAYAMA TOSHIAKI ; HASHIGUCHI TADASHI</creator><creatorcontrib>SHIRAHAMA TOSHIKI ; YAMAHARA KEIJI ; SAWAI TAKESHI ; KATAYAMA TOSHIAKI ; HASHIGUCHI TADASHI</creatorcontrib><description>A method for recovering or producing silicon, that can recover or produce silicon using cutting scraps containing silicon carbide abrasive grains and silicon as raw materials without separating those is provided. The present invention is a method for recovering or producing silicon from cutting scraps containing silicon carbide, which are produced during a cutting or grinding of silicon ingots or silicon wafers, wherein the method comprises producing silicon by heating the cutting scraps containing silicon carbide, and a silica raw material.</description><language>eng</language><subject>CHEMISTRY ; COMPOUNDS THEREOF ; INORGANIC CHEMISTRY ; METALLURGY ; NON-METALLIC ELEMENTS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130103&amp;DB=EPODOC&amp;CC=US&amp;NR=2013001816A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130103&amp;DB=EPODOC&amp;CC=US&amp;NR=2013001816A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIRAHAMA TOSHIKI</creatorcontrib><creatorcontrib>YAMAHARA KEIJI</creatorcontrib><creatorcontrib>SAWAI TAKESHI</creatorcontrib><creatorcontrib>KATAYAMA TOSHIAKI</creatorcontrib><creatorcontrib>HASHIGUCHI TADASHI</creatorcontrib><title>METHOD FOR RECOVERING SILICON AND METHOD FOR PRODUCING SILICON</title><description>A method for recovering or producing silicon, that can recover or produce silicon using cutting scraps containing silicon carbide abrasive grains and silicon as raw materials without separating those is provided. The present invention is a method for recovering or producing silicon from cutting scraps containing silicon carbide, which are produced during a cutting or grinding of silicon ingots or silicon wafers, wherein the method comprises producing silicon by heating the cutting scraps containing silicon carbide, and a silica raw material.</description><subject>CHEMISTRY</subject><subject>COMPOUNDS THEREOF</subject><subject>INORGANIC CHEMISTRY</subject><subject>METALLURGY</subject><subject>NON-METALLIC ELEMENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDzdQ3x8HdRcPMPUghydfYPcw3y9HNXCPb08XT291Nw9HNRQFIREOTvEuqMpICHgTUtMac4lRdKczMou7mGOHvophbkx6cWFyQmp-allsSHBhsZGBobGBhaGJo5GhoTpwoA9rAq6Q</recordid><startdate>20130103</startdate><enddate>20130103</enddate><creator>SHIRAHAMA TOSHIKI</creator><creator>YAMAHARA KEIJI</creator><creator>SAWAI TAKESHI</creator><creator>KATAYAMA TOSHIAKI</creator><creator>HASHIGUCHI TADASHI</creator><scope>EVB</scope></search><sort><creationdate>20130103</creationdate><title>METHOD FOR RECOVERING SILICON AND METHOD FOR PRODUCING SILICON</title><author>SHIRAHAMA TOSHIKI ; YAMAHARA KEIJI ; SAWAI TAKESHI ; KATAYAMA TOSHIAKI ; HASHIGUCHI TADASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013001816A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CHEMISTRY</topic><topic>COMPOUNDS THEREOF</topic><topic>INORGANIC CHEMISTRY</topic><topic>METALLURGY</topic><topic>NON-METALLIC ELEMENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIRAHAMA TOSHIKI</creatorcontrib><creatorcontrib>YAMAHARA KEIJI</creatorcontrib><creatorcontrib>SAWAI TAKESHI</creatorcontrib><creatorcontrib>KATAYAMA TOSHIAKI</creatorcontrib><creatorcontrib>HASHIGUCHI TADASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIRAHAMA TOSHIKI</au><au>YAMAHARA KEIJI</au><au>SAWAI TAKESHI</au><au>KATAYAMA TOSHIAKI</au><au>HASHIGUCHI TADASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR RECOVERING SILICON AND METHOD FOR PRODUCING SILICON</title><date>2013-01-03</date><risdate>2013</risdate><abstract>A method for recovering or producing silicon, that can recover or produce silicon using cutting scraps containing silicon carbide abrasive grains and silicon as raw materials without separating those is provided. The present invention is a method for recovering or producing silicon from cutting scraps containing silicon carbide, which are produced during a cutting or grinding of silicon ingots or silicon wafers, wherein the method comprises producing silicon by heating the cutting scraps containing silicon carbide, and a silica raw material.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2013001816A1
source esp@cenet
subjects CHEMISTRY
COMPOUNDS THEREOF
INORGANIC CHEMISTRY
METALLURGY
NON-METALLIC ELEMENTS
title METHOD FOR RECOVERING SILICON AND METHOD FOR PRODUCING SILICON
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T21%3A40%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHIRAHAMA%20TOSHIKI&rft.date=2013-01-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013001816A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true