METHOD FOR RECOVERING SILICON AND METHOD FOR PRODUCING SILICON

A method for recovering or producing silicon, that can recover or produce silicon using cutting scraps containing silicon carbide abrasive grains and silicon as raw materials without separating those is provided. The present invention is a method for recovering or producing silicon from cutting scra...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIRAHAMA TOSHIKI, YAMAHARA KEIJI, SAWAI TAKESHI, KATAYAMA TOSHIAKI, HASHIGUCHI TADASHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method for recovering or producing silicon, that can recover or produce silicon using cutting scraps containing silicon carbide abrasive grains and silicon as raw materials without separating those is provided. The present invention is a method for recovering or producing silicon from cutting scraps containing silicon carbide, which are produced during a cutting or grinding of silicon ingots or silicon wafers, wherein the method comprises producing silicon by heating the cutting scraps containing silicon carbide, and a silica raw material.