HOTMELT ADHESIVE COMPRISING RADIATION-CROSSLINKABLE POLY(METH)ACRYLATE AND OLIGO(METH)ACRYLATE WITH NONACRYLIC C-C DOUBLE BONDS

Described is a radiation-crosslinkable hotmelt adhesive comprising at least one radiation-crosslinkable poly(meth)acrylate formed to an extent of at least 60% by weight of C1 to C10 alkyl (meth)acrylates and at least one oligo(meth)acrylate which comprises nonacrylic C-C double bonds and has a K val...

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Bibliographische Detailangaben
Hauptverfasser:	LICHT ULRIKE, FILGES ULRICH, CHRIST THOMAS, WULFF DIRK
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Described is a radiation-crosslinkable hotmelt adhesive comprising at least one radiation-crosslinkable poly(meth)acrylate formed to an extent of at least 60% by weight of C1 to C10 alkyl (meth)acrylates and at least one oligo(meth)acrylate which comprises nonacrylic C-C double bonds and has a K value of less than or equal to 20. The hotmelt adhesive comprises a photoinitiator which may be present in the form of an additive not attached to the poly(meth)acrylate and/or not attached to the oligo(meth)acrylate, may be incorporated by copolymerization into the poly(meth)acrylate, and/or may be attached to the oligo(meth)acrylate. The hotmelt adhesive can be used for producing adhesive tapes.