METAL-RESIN COMPOSITE

Provided is a metal-resin composite provided with a layer consisting of a heat-resistant resin composition having a low permittivity or a low dielectric loss tangent. The composite can exhibit a low thermal expansion coefficient and a reduced transmission loss of an electric signal. The composite co...

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Bibliographische Detailangaben
Hauptverfasser:	YAMASHITA WATARU, TORIIDA MASAHIRO, NISHIURA KATSUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a metal-resin composite provided with a layer consisting of a heat-resistant resin composition having a low permittivity or a low dielectric loss tangent. The composite can exhibit a low thermal expansion coefficient and a reduced transmission loss of an electric signal. The composite comprises a metal and a resin layer (I). The resin layer (I) is made from a resin composition prepared by blending (A) a heat-resistant resin that exhibits a relative permittivity of 2.3 or more at a frequency of 1 MHz with (B) polyolefin particles having a mean particle diameter of 100 [mu]m or less. The resin composition has both a continuous phase of the heat-resistant resin (A) and a dispersed phase of the polyolefin particles (B), with the relative permittivity of the resin composition being lower than that of the heat-resistant resin (A).