MOLD APPARATUS

The present disclosure relates to a mold apparatus, and according to an aspect of the present disclosure, there is provided a mold apparatus including a cavity mold comprising a cavity mold plate formed with a cavity at a front surface thereof and provided with a heating means at an inner portion th...

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Bibliographische Detailangaben
Hauptverfasser:	LEE GYUSANG, HWANG MINKYU, JEONG SEOKJAE, KIM KYUNGDO, KIM JOOKWON, JUN HYUNWOO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present disclosure relates to a mold apparatus, and according to an aspect of the present disclosure, there is provided a mold apparatus including a cavity mold comprising a cavity mold plate formed with a cavity at a front surface thereof and provided with a heating means at an inner portion thereof, and a cooling plate brought into contact with or separated from a rear surface of the cavity mold plate and provided with a cooling means at an inner portion thereof; and a core mold configured to determine the cavity together with the cavity mold plate, wherein the cooling plate is formed with at least two or more divided surfaces.