BROKEN WAFER RECOVERY SYSTEM

An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without req...

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Bibliographische Detailangaben
Hauptverfasser: BLONIGAN WENDELL THOMAS, STEVENS CRAIG LYLE, BERKSTRESSER DAVID ERIC
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor.