Integrated Substrate Cleaning System and Method

Integrated Substrate Cleaning System and Method

A method for cleaning a substrate having organic and inorganic residues disposed thereon is provided. The method includes removing organic residue from the substrate using atmospheric oxygen plasma, and removing inorganic residue from the substrate using cryogenic CO2. The substrate may be pretreate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BALOOCH MEHDI, SWANSON GORDON SCOTT, VARGHESE IVIN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:A method for cleaning a substrate having organic and inorganic residues disposed thereon is provided. The method includes removing organic residue from the substrate using atmospheric oxygen plasma, and removing inorganic residue from the substrate using cryogenic CO2. The substrate may be pretreated using a benign cooling agent, and post-treated using a dilute wet chemical cleaning method.