ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES

The invention relates to Sn-Cu-Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.

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Hauptverfasser: SONG HYUN-JOON, JO YUN-HWAN, LEE HYUCK-MO, PARK JIAN, KIM DONG-HOON, LEE KWI-JONG, BANG JUNG-UP
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Sprache:eng
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creator SONG HYUN-JOON
JO YUN-HWAN
LEE HYUCK-MO
PARK JIAN
KIM DONG-HOON
LEE KWI-JONG
BANG JUNG-UP
description The invention relates to Sn-Cu-Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2012272790A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2012272790A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2012272790A13</originalsourceid><addsrcrecordid>eNqNjLsKwkAQANNYiPoPC7YGkrMIlstlkxzG3XCPwioEOQsRDcT_xwiWFlZTzDDL5IZtK2dgZOnQeqNbciAVOE51SLHeQWdpNuiNMJzIN1KCb8jSHCGXYPgIYqFD5wmCM1x_NPzYrpPFdbhPcfPlKtlW5HWTxvHZx2kcLvERX31wKsuVKlRxyDDf_1e9ATsUNtY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES</title><source>esp@cenet</source><creator>SONG HYUN-JOON ; JO YUN-HWAN ; LEE HYUCK-MO ; PARK JIAN ; KIM DONG-HOON ; LEE KWI-JONG ; BANG JUNG-UP</creator><creatorcontrib>SONG HYUN-JOON ; JO YUN-HWAN ; LEE HYUCK-MO ; PARK JIAN ; KIM DONG-HOON ; LEE KWI-JONG ; BANG JUNG-UP</creatorcontrib><description>The invention relates to Sn-Cu-Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.</description><language>eng</language><subject>ADHESIVES ; ALLOYS ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASTING ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CONDUCTORS ; CORRECTING FLUIDS ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DYES ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; FILLING PASTES ; INKS ; INSULATORS ; MACHINE TOOLS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES ; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NANOTECHNOLOGY ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; POWDER METALLURGY ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SOLDERING OR UNSOLDERING ; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; USE OF MATERIALS THEREFOR ; WELDING ; WOODSTAINS ; WORKING BY LASER BEAM ; WORKING METALLIC POWDER</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121101&amp;DB=EPODOC&amp;CC=US&amp;NR=2012272790A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121101&amp;DB=EPODOC&amp;CC=US&amp;NR=2012272790A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG HYUN-JOON</creatorcontrib><creatorcontrib>JO YUN-HWAN</creatorcontrib><creatorcontrib>LEE HYUCK-MO</creatorcontrib><creatorcontrib>PARK JIAN</creatorcontrib><creatorcontrib>KIM DONG-HOON</creatorcontrib><creatorcontrib>LEE KWI-JONG</creatorcontrib><creatorcontrib>BANG JUNG-UP</creatorcontrib><title>ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES</title><description>The invention relates to Sn-Cu-Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.</description><subject>ADHESIVES</subject><subject>ALLOYS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASTING</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>MACHINE TOOLS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</subject><subject>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NANOTECHNOLOGY</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POWDER METALLURGY</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WELDING</subject><subject>WOODSTAINS</subject><subject>WORKING BY LASER BEAM</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLsKwkAQANNYiPoPC7YGkrMIlstlkxzG3XCPwioEOQsRDcT_xwiWFlZTzDDL5IZtK2dgZOnQeqNbciAVOE51SLHeQWdpNuiNMJzIN1KCb8jSHCGXYPgIYqFD5wmCM1x_NPzYrpPFdbhPcfPlKtlW5HWTxvHZx2kcLvERX31wKsuVKlRxyDDf_1e9ATsUNtY</recordid><startdate>20121101</startdate><enddate>20121101</enddate><creator>SONG HYUN-JOON</creator><creator>JO YUN-HWAN</creator><creator>LEE HYUCK-MO</creator><creator>PARK JIAN</creator><creator>KIM DONG-HOON</creator><creator>LEE KWI-JONG</creator><creator>BANG JUNG-UP</creator><scope>EVB</scope></search><sort><creationdate>20121101</creationdate><title>ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES</title><author>SONG HYUN-JOON ; JO YUN-HWAN ; LEE HYUCK-MO ; PARK JIAN ; KIM DONG-HOON ; LEE KWI-JONG ; BANG JUNG-UP</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2012272790A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>ADHESIVES</topic><topic>ALLOYS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASTING</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>MACHINE TOOLS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</topic><topic>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NANOTECHNOLOGY</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>POWDER METALLURGY</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WELDING</topic><topic>WOODSTAINS</topic><topic>WORKING BY LASER BEAM</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>SONG HYUN-JOON</creatorcontrib><creatorcontrib>JO YUN-HWAN</creatorcontrib><creatorcontrib>LEE HYUCK-MO</creatorcontrib><creatorcontrib>PARK JIAN</creatorcontrib><creatorcontrib>KIM DONG-HOON</creatorcontrib><creatorcontrib>LEE KWI-JONG</creatorcontrib><creatorcontrib>BANG JUNG-UP</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONG HYUN-JOON</au><au>JO YUN-HWAN</au><au>LEE HYUCK-MO</au><au>PARK JIAN</au><au>KIM DONG-HOON</au><au>LEE KWI-JONG</au><au>BANG JUNG-UP</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES</title><date>2012-11-01</date><risdate>2012</risdate><abstract>The invention relates to Sn-Cu-Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.</abstract><oa>free_for_read</oa></addata></record>
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language eng
recordid cdi_epo_espacenet_US2012272790A1
source esp@cenet
subjects ADHESIVES
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CASTING
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CONDUCTORS
CORRECTING FLUIDS
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DYES
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
FILLING PASTES
INKS
INSULATORS
MACHINE TOOLS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NANOTECHNOLOGY
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
POLISHES
POWDER METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SOLDERING OR UNSOLDERING
SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
USE OF MATERIALS THEREFOR
WELDING
WOODSTAINS
WORKING BY LASER BEAM
WORKING METALLIC POWDER
title ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T02%3A28%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SONG%20HYUN-JOON&rft.date=2012-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2012272790A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true