ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES

The invention relates to Sn-Cu-Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.

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Bibliographische Detailangaben
Hauptverfasser: SONG HYUN-JOON, JO YUN-HWAN, LEE HYUCK-MO, PARK JIAN, KIM DONG-HOON, LEE KWI-JONG, BANG JUNG-UP
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention relates to Sn-Cu-Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.