DRAM PACKAGE, DRAM MODULE INCLUDING DRAM PACKAGE, GRAPHIC MODULE INCLUDING DRAM PACKAGE AND MULTIMEDIA DEVICE INCLUDING DRAM PACKAGE

DRAM PACKAGE, DRAM MODULE INCLUDING DRAM PACKAGE, GRAPHIC MODULE INCLUDING DRAM PACKAGE AND MULTIMEDIA DEVICE INCLUDING DRAM PACKAGE

A DRAM package includes a DRAM package body, and a ball grid array formed at a lower surface of the DRAM package body. The ball grid array includes a plurality of solder balls arranged in the equal interval along row and column directions. The DRAM package is included in an electronic apparatus.

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Bibliographische Detailangaben
Hauptverfasser: PARK SUNGJOO, SONG INDAL, CHOI JANGSEOK, KIM YONG-JIN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PICTORIAL COMMUNICATION, e.g. TELEVISION
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A DRAM package includes a DRAM package body, and a ball grid array formed at a lower surface of the DRAM package body. The ball grid array includes a plurality of solder balls arranged in the equal interval along row and column directions. The DRAM package is included in an electronic apparatus.