Semiconductor Light Emitting Diodes Having Multiple Bond Pads and Current Spreading Structures
A light emitting device includes a diode region comprising a first face and opposing edges, and a bond pad structure comprising at least three bond pads along only one of the opposing edges of the first face.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A light emitting device includes a diode region comprising a first face and opposing edges, and a bond pad structure comprising at least three bond pads along only one of the opposing edges of the first face. |
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