Semiconductor Light Emitting Diodes Having Multiple Bond Pads and Current Spreading Structures

A light emitting device includes a diode region comprising a first face and opposing edges, and a bond pad structure comprising at least three bond pads along only one of the opposing edges of the first face.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: DONOFRLO MATTHEW, EDMOND JOHN ADAM, PYLES SHAWN
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A light emitting device includes a diode region comprising a first face and opposing edges, and a bond pad structure comprising at least three bond pads along only one of the opposing edges of the first face.