WIRELESS SYSTEM-IN-PACKAGE AND IMAGE PROCESSING CONTROL APPARATUS
A system in a package includes a printed circuit board and first and second SOCs. The printed circuit board is connected to a second circuit board mounted within a printer. The first SOC is mounted on the printed circuit board and includes a receiver and a transmitter. The receiver receives a first...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A system in a package includes a printed circuit board and first and second SOCs. The printed circuit board is connected to a second circuit board mounted within a printer. The first SOC is mounted on the printed circuit board and includes a receiver and a transmitter. The receiver receives a first radio frequency signal from a low noise amplifier and generates a first baseband signal based on the first radio frequency signal. The transmitter transmits, based on a second baseband signal, a second radio frequency signal to a power amplifier. The second SOC is mounted on the printed circuit board and includes a baseband processing module and an imaging module. The baseband processing module processes the first baseband signal and the second baseband signal and generates a data signal based on the first baseband signal. The imaging module processes the data signal to implement physical printing. |
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