TEMPERATURE SENSOR USING TEMPERATURE SENSING DEVICES

The present subject matter relates generally to temperature sensors using one or a plurality of temperature sensing devices. Various embodiments of the present subject matter include a temperature sensor assembly. The temperature sensor assembly includes an enclosure having an inside surface and a t...

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Bibliographische Detailangaben
Hauptverfasser: KOCHSIEK BRANT ROBERT, BERNIER PETER DAVID, SHOGREN JONATHAN SPENCER
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present subject matter relates generally to temperature sensors using one or a plurality of temperature sensing devices. Various embodiments of the present subject matter include a temperature sensor assembly. The temperature sensor assembly includes an enclosure having an inside surface and a temperature sensing device housed in the enclosure. A thermally conductive material connects a surface of the temperature sensing device directly to the inside surface of the enclosure in a side mounted manner to provide rapid thermal conduction from the enclosure to the temperature sensing device. In various embodiments, the temperature sensing device is a resistance temperature detector (RTD).