PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE MATERIAL COMPRISING THE SAME

The present invention relates to a photosensitive resin composition and a photosensitive material comprising the same. The photosensitive resin composition according to an exemplary embodiment of the present invention may comprise two multi-functional monomers where structures of side chains compris...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JI HO CHAN, CHOI DONGCHANG, CHA GEUN YOUNG, LEE SANG CHUL, KIM SUNGHYUN, CHOI KYUNG SOO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present invention relates to a photosensitive resin composition and a photosensitive material comprising the same. The photosensitive resin composition according to an exemplary embodiment of the present invention may comprise two multi-functional monomers where structures of side chains comprising unsaturated double bonds are different from each other while a composition ratio is changed. Accordingly, in the exemplary embodiment of the present invention, processability is excellent, and it is possible to decrease defects by a rupture when a LCD substrate is sealed and substrate separation defects due to an impact to the LCD products by improving an adhesion property to a lower substrate after a hard baking process.