ELECTRONICS PATCH WITH ULTRA THIN ADHESIVE LAYER

An electronic patch comprising a patch body composed of a cured rubber composition and having an electronics component mounted thereto, the patch body comprising a bottom surface for bonding the electronics patch to an article. Also included is an adhesive layer of an uncured rubber composition appl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HOTALING ELIZABETH L, SINNETT JAY C
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An electronic patch comprising a patch body composed of a cured rubber composition and having an electronics component mounted thereto, the patch body comprising a bottom surface for bonding the electronics patch to an article. Also included is an adhesive layer of an uncured rubber composition applied to the patch bottom surface, wherein the adhesive layer is no more than 0.3 mm thick and is curable between 18° C. and 26° C. over 20 hours and 48 hours. A removable protective film may be applied to a bonding surface of the adhesive layer, wherein the protective film is removed prior to applying the patch to the article. A method is provided, including applying a vulcanizing agent to an interior surface of the tire and applying the electronics patch over the vulcanizing agent, wherein the protective film on the patch is removed prior to applying the electronics patch to the tire.