MULTI-LAYER DISTRIBUTED NETWORK

Apparatuses and processes for distributing signals in an integrated circuit are disclosed. An embodiment to use a custom layer together with a base layer on an integrated circuit for testing the integrated circuit includes having a structured network on the base layer. The custom layer connects the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LOB SIANG POH, OH KEONG HONG, LIM CHOOI PEI, TAN YEE LIANG
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Apparatuses and processes for distributing signals in an integrated circuit are disclosed. An embodiment to use a custom layer together with a base layer on an integrated circuit for testing the integrated circuit includes having a structured network on the base layer. The custom layer connects the network to logic elements on the integrated circuit. The network may be evenly distributed across the base layer of the integrated circuit. Even distribution of the network may reduce skew of the test signals. Buffers are also placed along the structured network. The buffers may be placed to ensure a deterministic test signals distribution. Unused buffers in the base layer may be tied off to reduce current leakage.