Semiconductor Device and Method of Manufacture Thereof

A semiconductor device and a method of making a semiconductor device are disclosed. The semiconductor device comprises a redistribution layer arranged over a chip, the redistribution layer comprising a first redistribution line. The semiconductor further comprises an isolation layer disposed over th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MEYER THORSTEN, HEITZER LUDWIG
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor device and a method of making a semiconductor device are disclosed. The semiconductor device comprises a redistribution layer arranged over a chip, the redistribution layer comprising a first redistribution line. The semiconductor further comprises an isolation layer disposed over the redistribution layer, the isolation layer having a first opening forming a first pad area and a first interconnect located in the first opening and in contact with the first redistribution line. The redistribution line in the first pad area is arranged orthogonal to a first direction to a neutral point of the semiconductor device.