RECONFIGURABLE SHAPE MEMORY POLYMER SUPPORT TOOLING

A support apparatus and method for providing structural support to a shape memory polymer (SMP) apparatus during fabrication of composite parts. The support apparatus may comprise an adjustable, rigid structural member and a plurality of SMP support components transitionable between a rigid and mall...

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Bibliographische Detailangaben
Hauptverfasser:	HAVENS DAVID E, EVERHART JOEL JAMES, MARGRAF THOMAS WOOD
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BLASTING ENGINEERING ELEMENTS AND UNITS FRAMES, CASINGS, OR BEDS OF ENGINES OR OTHER MACHINES ORAPPARATUS NOT SPECIFIC TO AN ENGINE, MACHINE, OR APPARATUSPROVIDED FOR ELSEWHERE GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STANDS OR SUPPORTS THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A support apparatus and method for providing structural support to a shape memory polymer (SMP) apparatus during fabrication of composite parts. The support apparatus may comprise an adjustable, rigid structural member and a plurality of SMP support components transitionable between a rigid and malleable state and fixed to an outer surface of the rigid structural member. The rigid structural member may extend in at least one cross-sectional dimension toward the SMP apparatus, pressing the SMP support components, in their malleable state, against the SMP apparatus. The SMP support components may thereby conform to a first surface of the SMP apparatus, then return to their rigid state while pressed against the SMP apparatus, thus providing a rigid load path between the SMP apparatus and the rigid structural member. Then composite material may be applied to a second surface of the SMP apparatus, opposite of the first surface.