METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM

A semiconductor device and a method for manufacturing the same of the present invention in which the semiconductor device is provided with a fuse structure or an electrode pad structure, suppress the copper blowing-out from a copper containing metal film. The semiconductor device comprises a silicon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKEWAKI TOSHIYUKI, WATANABE MARI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A semiconductor device and a method for manufacturing the same of the present invention in which the semiconductor device is provided with a fuse structure or an electrode pad structure, suppress the copper blowing-out from a copper containing metal film. The semiconductor device comprises a silicon substrate, SiO2film provided on the silicon substrate, copper films embedded in the SiO2 film, TiN films covering an upper face of a boundary region between an upper face of copper films and the copper films, and the SiO2 film, and SiON films covering an upper face of the TiN films.