Disposable Bond Gap Control Structures

In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the j...

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Bibliographische Detailangaben
Hauptverfasser: DIEP BUU, GOOCH ROLAND W
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the joining material. The BGCS is at least partially removed from the substrate.