Glue Composition for Circuit Board

A glue composition for use in printed circuit board to secure, insulates and protect electronic components thereon is disclosed. The glue composition includes between about 60 and about 75 weight percent MDI-based polyisocyanate prepolymer, between about 9 and about 25 weight percent flame retardant...

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Bibliographische Detailangaben
1. Verfasser:	CHANG CHIHING
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A glue composition for use in printed circuit board to secure, insulates and protect electronic components thereon is disclosed. The glue composition includes between about 60 and about 75 weight percent MDI-based polyisocyanate prepolymer, between about 9 and about 25 weight percent flame retardant without phosphorus and halogen, between about 15 and about 22 weight percent insulator and between about 1 and about 3 weight percent surfactant.