Semiconductor Devices and Methods of Manufacture Thereof

Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base...

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Bibliographische Detailangaben
Hauptverfasser: VON GLASOW ALEXANDER, KALTALIOGLU ERDEM, RUDERER ERWIN, TEWS HELMUT HORST, RIESS PHILIPP, BARTH HANS-JOACHIM, BAUMGARTNER PETER, BENETIK THOMAS
Format: Patent
Sprache:eng
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Zusammenfassung:Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of the plurality of first parallel conductive members, and a second base member is coupled to an end of the plurality of second parallel conductive members. A connecting member is disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member includes at least one elongated via.