Metal Foil with Electric Resistance Film and Production Method Thereof

A metal foil comprising an electric resistance film in which the metal foil is made of copper or copper alloy, the surface roughness of at least one surface thereof is set to a 10-point average roughness Rz of 6.0 μm to 8.0 μm, and an electric resistance film is formed on that surface, wherein the p...

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Bibliographische Detailangaben
1. Verfasser:	KUROSAWA TOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	A metal foil comprising an electric resistance film in which the metal foil is made of copper or copper alloy, the surface roughness of at least one surface thereof is set to a 10-point average roughness Rz of 6.0 μm to 8.0 μm, and an electric resistance film is formed on that surface, wherein the peel strength of the electric resistance film is 0.60 kN/m or more, and variation of the resistance value of the electric resistance film is ±10% or less. Provided is a copper foil with an electric resistance film in which an electric resistance film is formed on the copper foil to enable the resistor to be built into the substrate, the adhesiveness thereof to a resin substrate is ensured, and variation of the resistance value of the electric resistance film is reduced.