Diced Wafer Adaptor and a Method for Transferring a Diced Wafer

A diced wafer adaptor that includes: a cylindrical shaped inner portion, adapted to support and hold an annular frame and a membrane suspended within the annular frame and to apply vacuum to an outer portion of the membrane; wherein an inner portion of the membrane supports a diced wafer and is surr...

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Bibliographische Detailangaben
Hauptverfasser:	NISSANY ITZIK, VEKSTEIN URI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COMBINED OPERATIONS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS MACHINE TOOLS MANIPULATORS METAL-WORKING NOT OTHERWISE PROVIDED FOR OTHER WORKING OF METAL PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING TRANSPORTING UNIVERSAL MACHINE TOOLS
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Beschreibung
Zusammenfassung:	A diced wafer adaptor that includes: a cylindrical shaped inner portion, adapted to support and hold an annular frame and a membrane suspended within the annular frame and to apply vacuum to an outer portion of the membrane; wherein an inner portion of the membrane supports a diced wafer and is surrounded by the outer portion of the membrane; and an outer portion having a perimeter shaped substantially as a perimeter of a non-diced wafer.