INTEGRATED RESISTIVE HEATERS FOR MICROELECTRONIC DEVICES AND METHODS UTILIZING THE SAME

A device having a substrate having a first surface and a second opposing surface; and at least one electrical connection assembly, wherein each electrical connection assembly includes: a resistive heater disposed on the first surface of the substrate, wherein the resistive heater is electrically connected to a circuit via a heater electrical connection; an electrical connection precursor, wherein the electrical connection precursor includes a fusible conductive material that is electrically connected to a lead; and a first insulating layer, wherein the resistive heater is disposed beneath the electrical connection precursor, wherein the first insulating layer functions to electrically insulate the resistive heater and the heater electrical connection from the electrical connection precursor and the lead, and wherein activation of the resistive heater functions to at least partially flow the fusible conductive material, wherein each electrical connection assembly can be activated individually by passing a current through the resistive heater.