PROJECTION EXPOSURE METHOD AND PROJECTION EXPOSURE SYSTEM THEREFOR
The disclosure provides a projection exposure method for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask. The mask has a first pattern area with a first subpattern, and at least one second pattern area, arranged laterally offset from the first pattern area, wi...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The disclosure provides a projection exposure method for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask. The mask has a first pattern area with a first subpattern, and at least one second pattern area, arranged laterally offset from the first pattern area, with a second subpattern. The first subpattern is irradiated during a first illumination time interval with a first angular distribution, adapted to the first subpattern, of the illumination radiation. Thereafter, the second subpattern is irradiated during the second illumination time interval with a second angular distribution, adapted to the second subpattern, of the illumination radiation, said second angular distribution differing from the first angular distribution. |
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