PROCESS FOR SEALING A GLASS PACKAGE AND RESULTING GLASS PACKAGE

A method is provided for sealing one or more fill holes (42, 44) in a glass plate (14) of an organic dye solar cell and other glass packages by covering the hole(s) (42, 44) with a laser absorbing glass patch (52, 54). The outer perimeter of the glass patch (52, 54) is melted with a laser such that the outer perimeter of the glass patch (52, 54) is hermetically sealed to the glass plate (14). Another method is provided in which the fill holes (42, 44) are covered with a glass patch (52, 54) having a loop of absorbing frit around the outer periphery thereof. The loop of frit is melted with a laser such that the outer perimeter of the glass patch (52, 54) is hermetically sealed to the glass plate (14). In both process, the laser beam is either (1) formed into a loop shape beam around the perimeter of the glass patch (52, 54) or (2) quickly travels around the perimeter of the glass patch (52, 54) in such a manner that the loop of frit or the entire perimeter of the absorbing glass patch (52, 54) is uniformly heated to substantially the same temperature to minimize thermal stresses crated during heating and sealing.