IDENTIFYING DEFECTS

Identifying systematic defects in wafer processing including performing defect inspection of a plurality of wafers, identifying defects in each of the plurality of wafers as not being associated with a trivial and/or known root cause, determining a physical location on each wafer where each of the d...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KASSAB MAROUN, FAYAZ MOHAMMED F, PASTEL LEAH M, LEE JULIE L
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Identifying systematic defects in wafer processing including performing defect inspection of a plurality of wafers, identifying defects in each of the plurality of wafers as not being associated with a trivial and/or known root cause, determining a physical location on each wafer where each of the defects occurs and correlating the physical locations where each of the defects occurs with cell instances defined for those physical locations.