MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME

A MEMS device assembly (20) includes a MEMS die (22) and an integrated circuit (IC) die (24). The MEMS die (22) includes a MEMS device (36) formed on a substrate (38) and a cap layer (34). A packaging process (72) entails forming the MEMS device (36) on the substrate (38) and removing a material por...

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Bibliographische Detailangaben
Hauptverfasser:	SCHLARMANN MARK E, LIN YIZHEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A MEMS device assembly (20) includes a MEMS die (22) and an integrated circuit (IC) die (24). The MEMS die (22) includes a MEMS device (36) formed on a substrate (38) and a cap layer (34). A packaging process (72) entails forming the MEMS device (36) on the substrate (38) and removing a material portion of the substrate (38) surrounding the device (36) to form a cantilevered substrate platform (46) at which the MEMS device (36) resides. The cap layer (34) is coupled to the substrate (38) overlying the MEMS device (36). The MEMS die (22) is electrically interconnected with the IC die (24). Molding compound (32) is applied to substantially encapsulate the MEMS die (22), the IC die (24), and interconnects (30) that electrically interconnect the MEMS device (22) with the IC die (24). The cap layer (34) prevents the molding compound (32) from contacting the MEMS device (36).