Thermal Transfer and Acoustic Matching Layers for Ultrasound Transducer

Thermal Transfer and Acoustic Matching Layers for Ultrasound Transducer

Ultrasound transducers and methods of making ultrasound transducers with improved thermal characteristics are provided. An ultrasound transducer can include: a backing, a piezoelectric element attached to the backing, a first matching layer attached to the piezoelectric element, and a second matchin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TAI ALAN CHIUNG
Format: Patent
Sprache:eng
Schlagworte:
ELECTRICITY
FOR PERFORMING MECHANICAL WORK IN GENERAL
GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:Ultrasound transducers and methods of making ultrasound transducers with improved thermal characteristics are provided. An ultrasound transducer can include: a backing, a piezoelectric element attached to the backing, a first matching layer attached to the piezoelectric element, and a second matching layer attached to the first matching layer. The first matching layer can comprise metal and can have a thermal conductivity of about greater than 30 W/mK. The second matching layer can have a thermal conductivity of about 0.5-300 W/mK. The first matching layer can have an acoustic impedance of about 10-20 MRayl, and the second matching layer can have a lower acoustic impedance. The first matching layer can be thicker than the second matching layer. The ultrasound transducer can include a lens and a matching layer disposed between the piezoelectric element and the lens can be configured to conduct heat from the piezoelectric element to the backing.