Heat sink for an electronic component

Heat sink for an electronic component

Described is a heat sink for an electronic component. In at least one embodiment, the heat sink includes several cooling fins and carbon nanotubes, present between the top surface of the heat sink and the cooling fins. The carbon nanotubes extend from the top surface of the heat sink in the directio...

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Hauptverfasser: KELLER CHRISTIAN, MOEHLENKAMP GEORG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BLASTING
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
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creator KELLER CHRISTIAN
MOEHLENKAMP GEORG
description Described is a heat sink for an electronic component. In at least one embodiment, the heat sink includes several cooling fins and carbon nanotubes, present between the top surface of the heat sink and the cooling fins. The carbon nanotubes extend from the top surface of the heat sink in the direction toward one of the cooling fins and are oriented at an angle to the orientation of the associated cooling fin.
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subjects BASIC ELECTRIC ELEMENTS
BLASTING
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
title Heat sink for an electronic component
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