Heat sink for an electronic component

Described is a heat sink for an electronic component. In at least one embodiment, the heat sink includes several cooling fins and carbon nanotubes, present between the top surface of the heat sink and the cooling fins. The carbon nanotubes extend from the top surface of the heat sink in the directio...

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Bibliographische Detailangaben
Hauptverfasser:	KELLER CHRISTIAN, MOEHLENKAMP GEORG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	Described is a heat sink for an electronic component. In at least one embodiment, the heat sink includes several cooling fins and carbon nanotubes, present between the top surface of the heat sink and the cooling fins. The carbon nanotubes extend from the top surface of the heat sink in the direction toward one of the cooling fins and are oriented at an angle to the orientation of the associated cooling fin.