Method of manufacturing glass substrate and method of manufacturing electronic components

A plurality of via-holes are formed in panel-shaped glass, and a plurality of via-holes are formed in two bases. Then, the panel-shaped glass is interposed between the two bases, positions of a plurality of the via-holes of the bases and a plurality of the via-holes of the panel-shaped glass are ali...

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Bibliographische Detailangaben
1. Verfasser:	TERAO EIJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL RESONATORS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	A plurality of via-holes are formed in panel-shaped glass, and a plurality of via-holes are formed in two bases. Then, the panel-shaped glass is interposed between the two bases, positions of a plurality of the via-holes of the bases and a plurality of the via-holes of the panel-shaped glass are aligned, wires made of a conductive material are penetrated, and the wires between the two bases are stretched. Then, the panel-shaped glass is heated to a point higher than a softening point of the glass, the wires between the bases are buried by the glass, and the glass is cooled to form a glass ingot having the buried wires. Then, the ingot is sliced to form a glass substrate, the glass panel is polished to expose the wires on front and rear surfaces as the through electrodes.