ASSEMBLY AND METHOD FOR IMPROVED SINGULATION

A punch and die assembly for singulating an IC unit from a substrate, the assembly comprising an array of punches a guide block having opposed first and second faces with a plurality of elongate channels corresponding to each punch extending from said first to second face; a die block for supporting...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHEN XUE FANG, ZHANG JING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL SEMICONDUCTOR DEVICES TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	A punch and die assembly for singulating an IC unit from a substrate, the assembly comprising an array of punches a guide block having opposed first and second faces with a plurality of elongate channels corresponding to each punch extending from said first to second face; a die block for supporting said substrate, said die block having an array of punching zones at which the punches bear so as to singulate all or a portion of a peripheral edge of said IC units from the substrate.