STIFFNESS ENHANCED FILAMENTS
An embodiment of the invention includes a biocompatible stiffness enhanced pliable electrically conductive filament configured for contact with living tissue and electrical communication with such tissue. The pliability of the filament allows the distal end of the filament to remain at the original...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | An embodiment of the invention includes a biocompatible stiffness enhanced pliable electrically conductive filament configured for contact with living tissue and electrical communication with such tissue. The pliability of the filament allows the distal end of the filament to remain at the original site of penetration into the tissue despite the movement of the tissue relative to its surrounding environment. To temporarily stiffen the filament, a soluble stiffness enhancing coating is disposed over the filament. The coating may be in the form of a liquid which dries to a solid state after being applied to the filament and renders the filament sufficiently rigid such that under appropriate force, the filament is capable of penetrating into dense tissue. Once in place the stiffness enhancing coating dissolves due to contact with body fluids, the filament, in the absence of such coating, returns to its initial pliability. An electrical insulating layer is disposed over a portion of the filament to render it non-conductive with tissue in the area adjacent the insulating layer. For a filament with such insulating layer, the stiffness enhancing coating would be disposed over the insulating layer. The filament may also include anchoring means configured to further anchor the filament in place. |
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