HIGH SPEED MODULAR JACK

A modular jack (100) comprising a housing (200) defining an upper port and a lower port vertically stacked under the upper port, and a contact module (400) assembled to the housing. The contact modules each comprises a first vertical PCB (46) and a second vertical PCB (47) extending along a front-to...

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1. Verfasser: ZHANG ZHING
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A modular jack (100) comprising a housing (200) defining an upper port and a lower port vertically stacked under the upper port, and a contact module (400) assembled to the housing. The contact modules each comprises a first vertical PCB (46) and a second vertical PCB (47) extending along a front-to-rear direction, a vertical shield plate (50) disposed between the first vertical PCB and the second vertical PCB, a mating module, and a horizontal shield plate (418) disposed between the upper contact module and the lower contact module. The horizontal shield plate is disposed below the upper row of ports and above the lower row of ports and connecting the vertical shield plate.